Silicon Nitride
Advanced Ceramics Customized Manufacturing
Silicon Nitride
| Material Grades | Characteristics | Density (g/cm3) |
Rockwell hardness (HRA) |
Elastic modulus (GPa) |
Bending strength (MPa) |
Compressive strength (MPa) |
Thermal conductivity (25℃) {W/(m.k)} |
Coefficient of thermal expansion (1x10-6/℃) (20-1000℃) |
Fracture toughness |
| Silicon nitride (atmospheric pressure) | Si2N4 (pressureless sintering) | 3.18 | HV50:1400 | 300 | 600 | 3000 | 30 | 3 | 5-6 |
| Silicon nitride (hot pressed) | Si2N4 (Hot pressed) | 3.2 | HV50:1700 | 300 | 800 | 3000 | 50 | 3 | 6-7 |
The information provided in this table is for general material performance reference only. Customers should recognize that the exact properties of the material may vary depending on product configuration, although values for most properties can be closely controlled where specified. Nothing in this document shall be construed as providing absolute engineering data or constituting a warranty or representation. Please contact Dongxin for cost-effective design, development and manufacturing support.
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