Silicon carbide
| Material Types | Material characteristics | Bulk density (g/cm 3) |
Rockwell hardness (HRA) |
Elastic modulus (GPa) |
Flexural strength (MPa) |
Compressive strength (MPa) |
Thermal conductivity (25℃) {W/(m·K)} |
Coefficient of thermal expansion (1×10⁻⁶/°C) (20–1000°C) |
Application |
| DX101 (RBSiC) | SiC 88% | ≥3.05 | 90.6 | 375 | 374 | 2353 | 128 | 4.81 | |
| DX101A (RBSiC) | SiC 90% | 3.08 | 91 | 400 | 400 | ≥2200 | 190 | 2.73 | |
| DX101B (RBSiC) | Metal impurities <500 ppm | ≥3.06 | 91 | 400 | 400 | ≥2200 | 190 | 2.73 | |
| DX102 (RBSiC-G) | RBSiC+G | 2.80 | 80 | ||||||
| DX201 (SSiC) | SSIC | ≥3.10 | 94.1 | 425 | 436 | 2440 | 153 | 4.94 | |
| DX202 (SSiC-G) | 10% G | 2.90–2.95 | 89.5 | 291 | 276 | 895 | 137 | 4.80 | |
| DX202B (SSiC-G) | 10% G | 2.90–2.95 | 2332 (HV0.5) | 318 | 348 | 1464 | 132 | 4.73 | |
| DX202C (SSiC-G) | 15% G | 2.80–2.85 | / | 249 | 284 | 1176 | 97.9 | 4.66 | |
| DX202D (SSiC-G) | 20% G | 2.70–2.78 | / | 214 | 260 | 1046 | 101 | 4.68 | |
| DX202E (SSiC-G) | 30% Graphite | ≥2.70 | 681 (HV0.5) | 170 | 242 | 1031 | 77.5 | 4.69 | |
| DX203 (SSiC-P) | SSIC+Porous | 3.0–3.05 | 92.6 | 359 | 314 | / | 149 | 4.96 | |
| DX204 (SSiC-G-P) | SSIC+P+ Graphite | 2.80–2.84 | / | 336 | 232 | / | 135 | / | |
| DX205(SSiC) | Strengthen SSIC | ≥3.10 | / | 398 | 412 | 2814 | 114 | 4.75 | |
| Hot-Press Sintered Silicon Carbide | under testing | ||||||||
| Liquid-phase sintered silicon carbide a-SiC | |||||||||
| Liquid-phase sintered silicon carbide β-SiC | |||||||||
The information provided in this table is for general material performance reference only. Customers should recognize that the exact properties of the material may vary depending on product configuration, although values for most properties can be closely controlled where specified. Nothing in this document shall be construed as providing absolute engineering data or constituting a warranty or representation. Please contact Dongxin for cost-effective design, development and manufacturing support.
Microstructure determines macroscopic performance; structural integrity ensures long-term reliability.
1. High densification and low porosity → deliver outstanding corrosion and wear resistance;
2. Fine, uniform grains and optimized grain boundaries → enhanced strength, toughness, and crack resistance;
3. Control of crystal facets and surface microtopography → reduced friction and extended seal life;
4. Control of defects (such as cracks and porosity) → Ensures the long-term stable and safe operation of components;
5. Selection of crystal structure → Ensures the material’s intrinsic high hardness and chemical stability.
|
DX101 |
DX101A |
DX101B |
DX201 |
|
DX202 coarse particles |
DX202 fine particles |
DX203 |
DX204 |







